ウェットプロセス装置

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1. Introduction：

Fully automated PANEL FOUP Cleaners can be used for FOUP cleaning of ABF substrates, PCB substrates or glass substrates

and other fixtures that can be loaded in special cleaning baskets.

The vacuum drying technology of this equipment can achieve complete drying effect after PANEL FOUP cleaning, and is

designed according to customer needs. It also effectively cleans the dead corners of the PANEL FOUP structure, completely

dewatering and drying the internal space of the PANEL FOUP in a short period of time, improving the cleaning quality.

2.Advantages And Features：

-Fully automated production, using robots to automatically pick and place, online monitoring to keep abreast of production

status and details at any time. No personnel operation required.

-The Software and hardware design and human machine interface system planning which can be adjusted according to

customer needs.

-The PANEL FOUP performs cleaning with 360-degree rotation without dead ends, hot air and vacuum drying.

-Equipment customization and flexible selection to meet specific needs.

-Low equipment construction cost and low PANEL FOUP cleaning operation cost.

-SECS/GEM & MES information streaming and equipment planning which comply with international standards CE and SEMI

certification.

3.機械エリア：

8.9m(L) × 8.9m(W) × 3.0m(H) メンテナンススペースを含む

4. 洗浄対象物のサイズ：

650 x 650 x 900 mm or below

1. Introduction：

Fully automated FOUP/FOSB Cleaners for wafer and carrier FOUP/FOSB cleaning and other fixtures that can be loaded in dedicated cleaning baskets.

The vacuum drying technology of this equipment can achieve complete drying effect after FOUP/FOSB cleaning, and is designed according to customer needs. It also effectively cleans the dead corners of the FOUP/FOSB structure, completely dewatering and drying the internal space of the FOUP/FOSB in a short period of time, improving the cleaning quality.

2.Advantages And Features：

-Fully automated production, using robots to automatically pick and place, online monitoring to keep abreast of production status and details at any time. No personnel operation required.

-The Software and hardware design and human machine interface system planning which can be adjusted according to customer needs.

-The FOUP/FOSB performs cleaning with 360-degree rotation without dead ends, hot air and vacuum drying.

-Equipment customization and flexible selection to meet specific needs.

-Low equipment construction cost and low FOUP/FOSB cleaning operation cost.

-SECS/GEM & MES information streaming and equipment planning which comply with international standards CE and SEMI certification

3.機械エリア：

6m(L) × 5.3m(W) × 4m(H) メンテナンススペースを含む

4. 洗浄対象物のサイズ：

370 x 440 x 350 mm or  12” below

1. Introduction：

Fully automatic frame cleaning equipment, which can be applied to the cleaning of frame of ABF carrier boards, PCB substrates or glass substrates, and other fixtures that can be loaded in special cleaning baskets.

This equipment can clean, dewater and dry the frame, and can be designed and adjusted according to customer needs to ensure efficient removal of particulates and contaminants.

This equipment complies with Class 100 cleanroom standards and has an automatic loading and unloading system to ensure dust-free operation during the cleaning process.

2.Advantages And Features：

-Fully automated production, using robots to automatically pick and place, online monitoring to keep abreast of production status and details at any time. No personnel operation required.

-The software, hardware and human-machine monitoring system can be flexibly planned and adjusted according to demand.

-The frame performs cleaning with 360-degree rotation without dead ends, hot air and vacuum drying.

-Customized and low-cost equipment services are available to meet the specific needs of our customers.

-SECS/GEM & MES information streaming and equipment planning which comply with international standards CE and SEMI certification.

3.機械エリア：

9m(L) × 7.6m(W) × 3.1m(H) 含維修空間

4. 洗浄対象物のサイズ：

母框: 630 x 610 x 585 mm or below

子框: 597 x 568 x 7.5 mm or below